The EVG 610 Double-Sided Mask Aligner is a semi-automated mask aligner capable of double-sided lithography.
Mask size: 4 inches or 5 inches
Substrate size: Small pieces and 2-inch, 3-inch, and 4-inch substrates
Wavelengths available: 365 nm, 405 nm, and 435 nm
Resolution: > 1 um with optimum process conditions. The resolution also depends on the operating mode.
Top-side and bottom-side alignment capabilities
UV light uniformity of +/- 3% from LED lamp during exposure