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You are here: Home / Equipment / EVG 610 Double-sided Mask Aligner

EVG 610 Double-sided Mask Aligner

EVG 610 Double-sided Mask Aligner

The EVG 610 Double-Sided Mask Aligner is a semi-automated mask aligner capable of double-sided lithography.

Mask size: 4 inches or 5 inches

Substrate size: Small pieces and 2-inch, 3-inch, and 4-inch substrates

Wavelengths available: 365 nm, 405 nm, and 435 nm

Resolution:  > 1 um with optimum process conditions. The resolution also depends on the operating mode.

Top-side and bottom-side alignment capabilities

UV light uniformity of +/- 3% from LED lamp during exposure

**Note** that AggieFab provides the following resists for use in the mask aligners: Shipley 1818, AZ214, and AZ nLOF2000.

AZ nLOF 2000 flyer

AZ nLOF 2000 data package

AggieFab also provides the following developers and strippers:

TMAH 25% in water
AZ 400T stripper
AZ developer 1:1
AZ 300 MIF developer
AZ 726 MIF developer
MIBK/IPA developer
MIF-319 developer

EVG610 Brochure

EVG 610 Double-Sided Mask Aligner Standard Operating Procedure

Primary Sidebar

Lithography/Patterning

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EVG 610 Double-sided Mask Aligner

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AggieFab Nanofabrication Facility (AggieFab)

Frederick E. Giesecke Engineering Research Building
1617 Research Parkway
College Station, TX 77843

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Texas A&M University Department of Electrical and Computer Engineering
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