The EVG 610 Double-Sided Mask Aligner is a semi-automatic mask aligner capable of double-side lithography.
Mask size: 4-inch or 5-inch
Substrate size: Small pieces, 2-inch, 3-inch, or 4-inch substrates
Wavelengths available: 365 nm, 405 nm, 435 nm
Resolution: > 1 um with optimum process conditions. The resolution also depends on operating mode.
Top-side and bottom-side alignment capabilities
UV light uniformity of +/- 3% from LED lamp during exposure