The EVG 610 Double-Sided Mask Aligner is a semi-automated mask aligner capable of double-sided lithography.
Mask size: 4″, 5″, and 7″
Substrate size: Small pieces and 2″, 3″, 4″ and 6″ substrates
Wavelengths available: 365 nm, 405 nm, and 435 nm
Resolution: > 1 um with optimum process conditions. The resolution also depends on the operating mode.
Top-side and bottom-side alignment capabilities
UV light uniformity of +/- 3% from LED lamp during exposure
**Note** that AggieFab provides the following resists for use in the mask aligners: Shipley 1818, AZ 214, and AZ nLOF2000. AZ P4620 is also provided for DRIE applications. See informative flyers below:
AggieFab also provides the following developers and strippers:
TMAH 25% in water
AZ 400T stripper
AZ developer 1:1
AZ 300 MIF developer
AZ 726 MIF developer
MIBK/IPA developer
MIF-319 developer
