The Heidelberg MLA150 (1) is
a maskless direct laser writing system for photolithography, enabling rapid
prototyping without the need for physical photomasks. The MLA150 supports
sub-micron feature photolithography, greyscale lithography, and photomask generation.
- Laser wavelength: 375 nm
- Minimum feature size: 600 nm
- Substrate size: 5 × 5 mm to 200 × 200 mm
- Substrate thickness: 0.1 mm to 12 mm
- Photomask production capability: Up to 8-inch photomasks
- Accepted file formats: GDSII, DXF, CIS, and Gerber
- Photomask availability: 4″, 5″ and 7″ blank photomasks are available for purchase through AggieFab staff
General Resources:
Heidelberg MLA150 Standard Operating Procedure
Laser Safety Classification at AggieFab
Resists Available at AggieFab for MLA150:
Resist | Typical Use |
Shipley 1805 | Thin positive photoresist |
Shipley 1818 | Standard positive photoresist |
AZ 5214 | Image reversal or positive tone |
AZ nLOF 2000 | Negative photoresist |
AZ P4620 | Thick positive photoresist (e.g., for DRIE) |
LOR 3A | For bi-layer lift-off processing |
Informative Flyers & Data:
Shipley 1800 series data package
Developers & Strippers available at AggieFab:
Chemical | Type |
AZ 400K (1:4) | Developer (diluted) |
AZ 300 MIF | Developer |
MIF-319 | Developer |
AZ 726 MIF | Developer |
AZ 400T | Stripper |
Please use iLab to reserve time on this equipment.
