The LESKER PVD 75 RF Sputtering tool deposits thin films with the RF sputtering technique. The RF mode of sputter deposition is used to deposit thin layers of insulating materials.
Target materials: Al2O3, AlN, ITO, Si, SiO2*, TaN, and TiN (* provided by AggieFab)
Other materials can also be deposited upon request by a user and approval by the Material Review Board (MRB)
Deposition orientation: Sputter Up
Substrate size: up to 150 mm
Substrate rotation: up to 20 rpm
Please use the iLab system to schedule time to use this equipment.
Lesker PVD 75 RF Dielectric Sputter Standard Operating Procedure
