The LESKER PVD 75 RF Sputtering is a thin film deposition system based on RF sputtering technique. The RF mode of sputter deposition is used to deposit thin layers of Insulator materials.
Target materials: Al2O3, AlN, ITO, Si, SiO2*, TaN, TiN (* provided by AggieFab)
Other materials can also be deposited upon request by a user and approved by the Material Review Board (MRB)
Deposition orientation: Sputtering Up
Substrate size: up to 150 mm
Substrate rotation: up to 20 rpm
Please use the iLab system to schedule time to use this equipment.
Lesker PVD 75 RF Dielectric Sputter Standard Operating Procedure
