The LESKER PVD 75 RF Sputtering tool deposits thin films with the RF sputtering technique. The RF mode of sputter deposition is used to deposit thin layers of insulating materials.
AggieFab provided target material: SiO2
Target materials available for a nominal fee: Al2O3, AlN, ITO, Si, TaN, and TiN
Deposition orientation: Sputter Up
Substrate size: up to 150 mm
Substrate rotation: up to 20 rpm
Other materials can also be deposited in the RF sputter tool. Please review the list of approved materials to see if the material of interest is already allowed into AggieFab. If it is not, please forward the request for a new material to Sandra Malhotra (sandra.malhotra@tamu.edu), who will forward the request to the Material Review Board (MRB).
Please use the iLab system to schedule time to use this equipment.
Lesker PVD 75 RF Dielectric Sputter Standard Operating Procedure
