Operation Spec Lesker DC PVD 75 Metal Sputter Rev3The LESKER PVD 75 DC Sputtering is a thin film deposition system based on direct current (DC) sputtering. Conductive target materials can be sputter deposited in DC mode.
AggieFab provided target materials: Al, Cr, Cu, Ni, Ti
Deposition orientation: Sputter Up
Substrate size: up to 150 mm
Substrate rotation: up to 20 rpm
Other materials can also be deposited in the DC sputter tool. Please review the list of approved materials to see if the material of interest is already allowed into AggieFab. If it is not, please forward the request for a new material to Sandra Malhotra ([email protected]), who will forward the request to the Material Review Board (MRB).
Please use the iLab system to schedule time to use this equipment.
Lesker PVD 75 DC Sputter Standard Operating Procedure
Lesker PVD 75 DC Sputter Process Monitor Data
