The LESKER PVD 75 DC Sputtering is a thin film deposition system based on direct current (DC) sputtering. Conductive target materials can be sputter deposited in DC mode.
Target materials: Al*, Cr*, Cu*, Mo, Nb, Ni*, Pt, Ta, Ti*, and W (* provided by AggieFab)
Other materials can also be deposited upon request by a user and approved by the Material Review Board (MRB)
Deposition orientation: Sputter Up
Substrate size: up to 150 mm
Substrate rotation: up to 20 rpm
Please use the iLab system to schedule time to use this equipment.
