The Clustex 100sp physical vapor deposition (PVD) tool sputters thin films onto substrates that have a diameter up to 4”. The substrate can be coated either by one magnetron sputtering target or simultaneously by up to three magnetron sputtering targets.
The process chamber is equipped with 20 magnetron targets
There are 16 RF and 3 DC sputtering heads as well as an ion source
Substrate temperature: up to 1000°C using a ceramic heater
Available gases: N2, Ar, and O2
Approved Target Materials: SiO2, W, VO2, Nb2O5, Si, TiN, Al2O3, Ir, NbO2, HfO2, V, TiO2, Ru, V2O5, Hf, Ti, Al, Cu, MgO, and SrTiO3
The approved materials list will change over time. Please contact the AggieFab staff with questions.
Clustex 100sp Standard Operating Procedure
Please use the iLab system to schedule time to use this equipment.
