The EVG 501 Wafer Bonder provides various types of wafer bonding, including thermal bonding and anodic bonding.
This equipment was purchased through the Texas A&M University Research Development Fund (RDF).
Bonding Types: Thermo-compressive and anodic bonding
Wafer dimensions: Allows for bonding of <100 mm wafers up to 100 mm wafers. Smaller pieces can be also bonded.
Operating temperature: Up to 450°C (150 mm top and bottom heaters) with passive cooling
Bond force: Up to 10 kN
Anodic bond package: 2000 V / 50 mA
Environments: Wafer contact in vacuum and/or other defined atmosphere
Compatible with EVG 610 Double Side Mask Aligner, allowing wafer alignment capability.
Please use the iLab system to schedule time to use this equipment.