The EVG 501 Wafer Bonder is capable of various types of wafer bonding, including thermal bonding and anodic bonding.
Installation finished and in operation now. This equipment has been purchased through the Texas A&M University Research Development Fund (RDF).
Bonding Types: Thermocompressive and anodic bonding capability
Wafer dimensions: Allows for bonding of <100 mm wafers => Allows for bonding of up to 100 mm wafers. Smaller pieces can be also bonded.
Operating temperature: Up to 450°C (150 mm top and bottom heaters) with passive cooling
Bond force: Up to 10 kN
Anodic bond package: 2000 V / 50 mA
Environments: Wafer contact in vacuum and/or other defined atmosphere
Compatible with EVG 610 Double Side Mask Aligner, allowing wafer alignment capability.
Please use the iLab system to schedule time to use this equipment.