The Lesker PVD 75 Electron Beam Evaporation tool is a metal thin film deposition system based on the electron beam evaporation technique. The ability to control the deposition rate, obtain a film with low contamination, and obtain very high deposition rates are the advantages of electron beam evaporation.
Deposition materials: Al*, Au, Cr*, Cu*, Mo, Ni*, Pt, Ta, Ti*, and W (* provided by AggieFab)
Other materials can also be deposited upon request by a user and approved by the Material Review Board (MRB)
Deposition orientation: Evaporation Up
Deposition sources: 4 pocket (multilayer deposition)
Film thickness controller: Quartz Crystal Microbalance (QCM)
Substrate size: up to 200 mm
Substrate rotation: up to 20 rpm
Please use the iLab system to schedule this equipment.
Lesker PVD 75 E-beam Evaporator Standard Operating Procedure
