The Lesker PVD 75 Electron Beam Evaporation tool is a metal thin film deposition system based on the electron beam evaporation technique. The ability to control the deposition rate, obtain a film with low contamination, and obtain very high deposition rates are the advantages of electron beam evaporation.
Provided pellets for ebeam deposition: Al, Cr, Cu, Ni, and Ti
Deposition orientation: Evaporation Up
Deposition sources: 4 pockets (multilayer deposition)
Film thickness controller: Quartz Crystal Microbalance (QCM)
Substrate size: up to 200 mm
Substrate rotation: up to 20 rpm
Other materials can also be deposited in EBE1 and EBE2. Please review the list of approved materials to see if the material of interest is already allowed into AggieFab. If it is not, please forward the request for a new material to Sandra Malhotra (sandra.malhotra@tamu.edu), who will forward the request to the Material Review Board (MRB).
Please use the iLab system to schedule this equipment.
Lesker PVD 75 E-beam Evaporator Standard Operating Procedure
