The Lesker PVD 75 Electron-Beam Evaporation is a metal thin film deposition system based on an electron beam evaporation technique. Ability to control deposition rate, low contamination, and very high deposition rates are the advantages of electron beam evaporation.
Deposition materials: Al*, Au, Cr*, Cu*, Mo, Ni*, Pt, Ta, Ti*, W (* provided by AggieFab)
Other materials can also be deposited upon request by a user and approved by the Material Review Board (MRB)
Deposition orientation: Evaporation Up
Deposition sources: 4 pocket (multilayer deposition)
Film thickness controller: Quartz Crystal Microbalance (QCM)
Substrate size: up to 200 mm
Substrate rotation: up to 20 rpm
Please use the iLab system to schedule this equipment.
Lesker PVD 75 E-beam Evaporator Standard Operating Procedure
