The MICRO AUTOMATION 1100 Dicing Saw is a microprocessor-controlled, programmable, and automatic dicing saw for cutting semiconductor wafers and glass substrates.
Cutting methods: Dicing and Scribing
Wafer dimensions: 2 – 6”
Wafer thickness: 1 – 500 mils
Spindle speed: 15,000 – 40,000 rpm
Operating temperature: 25°C
Micro Automation Dicing Saw Standard Operating Procedure
Please use the iLab system to schedule time to use this equipment.
