
The MPP iBond5000 Manual Dual Wire Bonder is used to bond aluminum or gold wire to a sample. This wire bonder can create both ball and wedge bonds and can bond a wire to two separate points on a single sample or bond to two separate samples.
AggieFab Provided Material: Al/1%Si Wire
Al/1%Si Wire Thickness: 1 mil (0.001″)
Coming Soon: MPP Dual Wire Bonder Standard Operating Procedure
Coming Soon: MPP Dual Wire Bonder Flyer
Please use the iLab system to schedule time to use this equipment.