The SUSS MA6 Mask Aligner Photo-Lithography is a mask aligner designed for high-resolution photolithography, mostly in the micrometer scale.
Wafer size: up to 4”
Mask size: up to 5”
Wavelength range: 350 – 450 nm
Exposure source: Hg lamp 350 W
Exposure contact: Soft, Hard, Vacuum
Resolution: down to 1 µm
Alignment method: Top Side Alignment (TSA)
Please use the iLab system to schedule time to use this equipment.