The Cu Technic Semcon 1000 Electroplater is a wet bench system for precise and uniform copper deposition. This system is equipped with a control panel to create and run processes. Additionally it has a Reciprocating Sparger System for plating on high aspect ratio vias and thick resist patterns; Anode and Cathode Shielding for controlling the electric field distribution and plating uniformity across the substrate; and Dry backside wafer racks to protect the backside of the wafers.
- Substrate Size: 4″, 6″, and 8″ wafers
- Temperature Range: 30°C – 40°C
- Plating Chemistry: Cu D3000
- Copper Concentration: 50 g/L
- Applications: Pillars, RDL, Cu stacks
Coming Soon: Electroplater Standard Operating Procedure
