Overview
The Technic Semcon™ 1000 is a wafer-scale electroplating system designed for controlled copper deposition on conductive substrates. The system supports semiconductor process development through programmable current control, temperature-controlled electrolyte circulation, and configurable plating parameters.
Capabilities
- Copper electroplating on conductive wafer substrates
- Patterned and blanket wafer processing
- Programmable current-controlled deposition
- Temperature-controlled bath (30–40 °C)
- Reciprocating sparger agitation
- Recipe-based process control
System Specifications
Parameter |
|
Wafer Size | 4″, 6″, 8″ |
Chemistry | Technic Elevate™ Cu D3000 |
Copper Concentration | 50 g/L |
Temperature | 30–40 °C |
Power Supply | Programmable DC |
Deposition Mode | Current-controlled electroplating |
Typical Applications
- Copper redistribution layers (RDL)
- Copper pillars
- Copper build-up layers
- Wafer-level metallization
- MEMS metallization
- Semiconductor process development
