The Evatec CLN200E ScAlN Sputtering System is a physical vapor deposition tool specifically for sputtering highly doped AlScN. This material is useful for a wide range of MEMS and microelectronic applications due to its high piezoelectric coefficient and low ferroelectric polarization switching voltage. This system features co-sputtering capabilities for better control of Al:Sc ratio and a load lock for improved process efficiency.
Substrate Size: 4″, 6″, and 8″ wafers
Sc Doping: Up to 30%
Available Gases: Ar, N2, and O2
Substrate Heating: up to 500°C
Wafer-in-Wafer Thickness Uniformity: ≤3%
Wafer-to-Wafer Thickness Uniformity: ≤1%
Roughness Average: ≤2.5nm
XRD R.C FWHM: ≤2.0°
Coming Soon: Evatec Sputter Standard Operating Procedure
