Overview
The Technic Semcon™ 1000 is a wafer-scale electroplating system designed for controlled nickel deposition on conductive substrates. The system supports semiconductor process development through programmable current control, temperature-controlled electrolyte circulation, and configurable plating parameters.
Capabilities
- Nickel electroplating on conductive wafer substrates
- Patterned and blanket wafer processing
- Programmable current-controlled deposition
- Temperature-controlled bath 30–55 °C
- Reciprocating sparger agitation
- Recipe-based process control
System Specifications
Parameter |
|
Wafer Size | 4″, 6″, 8″ |
Chemistry | Technic Elevate™ Ni 5950 |
Copper Concentration | 135 – 155 g/L |
Temperature | 30–55 °C |
Power Supply | Programmable DC |
Deposition Mode | Current-controlled electroplating |
Typical Applications
- Nickel under bump metallization (UBM)
- Diffusion barrier layers
- MEMS metallization
- Wear-resistant coatings
- Electroformed nickel structures
- Semiconductor process development
