The SUSS MA6 is a mask aligner designed for high-resolution photolithography at the micrometer scale.
Wafer size: up to 4”
Mask size: up to 5”
Wavelength range: 350 – 450 nm
Exposure source: Hg lamp 350 W
Exposure contact: Soft, Hard, and Vacuum
Resolution: down to 1 µm
Alignment method: Top Side Alignment (TSA)
**Note** that AggieFab provides the following resists for use in the mask aligners: Shipley 1818, AZ 214, and AZ nLOF2000. AZ P4620 is also provided for DRIE applications. See informative flyers below.
AggieFab also provides the following developers and strippers:
TMAH 25% in water
AZ 400T stripper
AZ developer 1:1
AZ 300 MIF developer
AZ 726 MIF developer
MIBK/IPA developer
MIF-319 developer
Please use the iLab system to schedule time to use this equipment.
