The MICRO AUTOMATION 1100 Dicing Saw is a microprocessor-controlled, programmable, and automatic dicing saw for cutting semiconductor wafers and glass substrates. AggieFab provides two separate dicing saws, one with optics installed for alignment and another with a monitor installed for alignment.
Dicing Saw 1: Monitor based alignment (A5 on AggieFab schematic)
Dicing Saw 1 Standard Operating Procedure
Dicing Saw 2: Optics based alignment (A9 on AggieFab schematic)
Dicing Saw 2 Standard Operating Procedure
Cutting methods: Dicing and Scribing
Wafer dimensions: 2 – 6”
Wafer thickness: 1 – 500 mils
Spindle speed: 15,000 – 40,000 rpm
Operating temperature: 25°C
Please use the iLab system to schedule time to use this equipment.
***Note that a special tape and UV curing system are available to ease removal of diced die from tape***
