The hot plate vacuum chamber is intended for annealing and drying processes under a low vacuum and at a low temperature. The equipment is supplied with air for venting. The equipment specs are as follows:
• Maximum wafer size: 4” diameter
• Temperature range: ≤250°C
• Pressure range: 1 atm to 200 torr with a small vacuum pump (installed)
**Note: This piece of equipment is not on iLab and cannot be reserved through iLab. Users must be trained and then check it out from Jung Hwan Woo ([email protected]).**
Standard Operating Procedure for the Hot Plate Vacuum Chamber
