The Clustex 100sp physical vapor deposition (PVD) tool is permanently offline and will be removed from AggieFab.
RF and DC sputtering can be completed on our Lesker PVD200 tools with 3″ targets. Please see AggieFab staff for detailed information.
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The Clustex 100sp physical vapor deposition (PVD) tool sputters thin films onto substrates that have a diameter up to 4”. The substrate can be coated either by one magnetron sputtering target or simultaneously by up to three magnetron sputtering targets.
The process chamber is equipped with 20 magnetron targets
There are 16 RF and 3 DC sputtering heads as well as an ion source
Substrate temperature: up to 1000°C using a ceramic heater
Available gases: N2, Ar, and O2
Currently Installed 2″ Target Materials: Er2O5, W, Er, Ta2O5, TaN, TiN, Al2O3, Mo, Ni, HfO2, Ta, TiO2, Ru, V2O5, Hf, Ti, Al, Pt, Cu
Available Uninstalled 2″ Target Materials: Ag, Al, Cu, Cu2O, HfN, HfO2, Ir, MoO3, Nb2O5, NbN, NbO2, NiO, Si, Si3N4, SiO2, Ta, TaC, TaO1.8, TaO2, TaO2.2, Ti4O7, TiC, TiN, V2O5, VO2, WO3
Please contact the AggieFab staff with questions about the above targets or requests to install a new target.
Clustex 100sp Standard Operating Procedure
Please use the iLab system to schedule time to use this equipment.
