The CN1 Atomic Premium Thermal ALD is a showerhead type atomic layer deposition tool used for depositing extremely thin layers of various materials. This ALD uses high temperatures to perform depositions.
Wafer size: up to 8”
Load Lock: Automatic loading and unloading
Purge Gas: Ar
Max. Temperature: 500C
Forming Gas: O3
Precursor installed: TEMAHf for HfO2
Precursors to be installed: TMA for Al2O3 and CpZr for ZrO2
