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The Au Technic Semcon 1000 Electroplater is a wet bench system for precise and uniform gold deposition. This system is equipped with a control panel to create and run processes. Additionally it has a Reciprocating Sparger System for plating on high aspect ratio vias and thick resist patterns; Anode and Cathode Shielding for controlling the electric field distribution and plating uniformity across the substrate; and Dry backside wafer racks to protect the backside of the wafers.
- Substrate Size: 4″, 6″, and 8″ wafers
- Temperature Range: 45°C – 65°C
- Plating Chemistry: Information forthcoming
- Gold Concentration: Information forthcoming
- Applications: Pillars, RDL, Au stacks
Coming Soon: Electroplater Standard Operating Procedure
