The Oxford Estrelas DRIE is designed to give total flexibility for Deep Reactive Ion Etching (DRIE) applications – serving a diverse set of process requirements across the Micro Electromechanical Systems (MEMS), Advanced Packaging and Nanotechnology markets. Developed for research and volume production, the PlasmaPro 100 Estrelas offers the ultimate flexibility with Bosch and Cryogenic processes.
Wafer size: coupons – 200 mm wafers
Load-locked chamber
Helium backside cooling
Temperature: 0 °C-50 °C
Table Power: 0-200 W
ICP power: 0-3000 W
Total gas flow: 10-1000 sccm
Pressure: 10-90 mTorr
Helium pressure: 0-10 Torr
Available gases: SF6, C4F8, O2, and Ar
Please use the iLab system to schedule time to use this equipment.
AZ P4620 resist is also provided for DRIE applications.. See the informative flyer here.
Review the Oxford Estrelas DRIE Standard Operating Procedure prior to training.
