The G&P POLI-400L CMP Tool is used for automatic chemical mechanical polishing of samples. This process is widely used in a semiconductor manufacturing technology because it enables surface planarization and material removal with high uniformity. This tool is equipped with a Friction force and Temperature Monitoring System and an easily replaceable upper platen to maximize pad usage for different process applications (eg. metal and oxide process shift). Additionally, a membrane type polishing head provides uniform pressure distribution throughout the process.
- Substrate Size: 4″ and 6″ wafers
- Platen Speed: 30 – 200 rpm
- Polishing Head Speed: 30 – 200 rpm
- Polishing Head Pressure: 70 – 500 g/cm2
- Polishing Head Oscillation: ±12 mm
- Conditioner: Swing arm
Coming Soon: CMP Standard Operating Procedure
