The Diener Plasma Cleaner is a simple plasma tool for wafer cleaning and descum. This tool is easy to operate and can be used for both flat and non-flat samples.
- Sample size: Up to 6″ wafers
- Sample configurations: Non-flat samples can be processed and large pieces may be run individually (in a horizontal configuration)
- Substrate materials: Silicon, III-V semiconductors, glass, and metal substrates may be processed; multiple wafers can be processed in a cassette
- RF power: 13.56 MHz, 0 – 300 W
- Process gases: O2 and Ar
