The CN1 Atomic Premium Thermal ALD is a showerhead type atomic layer deposition tool used for depositing extremely thin layers of various materials. This ALD uses high temperatures to perform depositions.
Wafer size: up to 8”
Load Lock: Automatic loading and unloading
Purge Gas: Ar
Max. Temperature: 500C
Forming Gas: O3
Precursor installed on thermal tool: TMA (for Al2O3) and TEMAHf (for HfO2)
Precursors to be installed on plasma-enhanced tool upon receipt in Dec ’25 timeframe: TMA (for AlN), BDEAS (for SiN), and 3DMAS (for SiO2)
