The CN1 Atomic Premium PEALD is a showerhead type atomic layer deposition tool used for depositing extremely thin layers of various materials. This ALD uses a plasma to perform depositions.
Wafer size: up to 8”
Load Lock: Automatic loading and unloading
Purge Gas: Ar
Max. Temperature: 500C
Power: 13.56MHz 600W RF Generator
Forming Gas: 5% H2 in N2
Precursor installed on thermal tool: TMA (for Al2O3) and TEMAHf (for HfO2)
Precursors to be installed on plasma-enhanced tool upon receipt in Dec ’25 timeframe: TMA (for AlN), BDEAS (for SiN), and 3DMAS (for SiO2)
