The CN1 Atomic Premium PEALD is a showerhead type atomic layer deposition tool used for depositing extremely thin layers of various materials. This ALD uses a plasma to perform depositions.
Wafer size: up to 8”
Load Lock: Automatic loading and unloading
Purge Gas: Ar
Max. Temperature: 500C
Power: 13.56MHz 600W RF Generator
Forming Gas: 5% H2 in N2
Precursors to be installed: TMA for AlN (ETA September), BDEAS for SiO2 and Si3N4 (ETA TBD)
Coming Soon: CN1 ALD Standard Operating Procedure
