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You are here: Home / Equipment / Elionix ELS-BODEN 150 Electron Beam Lithography System

Elionix ELS-BODEN 150 Electron Beam Lithography System

Elionix ELS-BODEN 150 Electron Beam Lithography System

The Elionix ELS-BODEN 150 EBL is an ultra-high precision electron beam lithography system that uses leading edge technology to produce nanometer scale devices and structures. This tool comes with an Environmental Enclosure for temperature control. It also includes a Pre-Alignment Station and a Multiple Position Auto Loader for automatic batch processing.

E-beam column

  • Min. line width: 4 nm
  • Acceleration voltage: 150 kV
  • Beam current: 5pA – 100 nA
  • Beam diameter: 1.5 nm
  • Beam position accuracy: 0.1 nm
  • Max. field size: 500 µm
  • Clock speed: 200 MHz
  • SE & BSE detectors

Environmental enclosure

  • Temperature control within 0.1°C/hour
  • EMI field cancellation

Auto Loader

  • Substrate size: up to 8” wafer
  • Best Field stitching : ±10 nm
  • Auto Loader
    • 6 substrate holders
    • Automatic batch processing

Elionix Flyer

Elionix EBL Standard Operating Procedure

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Lithography/Patterning

Nanoscribe Photonics GT2 high-resolution 3D Printer Direct Laser Write Lithography

CEE X-Pro II Auto-Developer Workstation

UpNano NanoOne 1000 US 2PP 3D printer

Heidelberg MLA150 Maskless Lithography System

Heidelberg MLA150 (2) Maskless Lithography System

EVG 610 Double-sided Mask Aligner

CEE X-Pro II Spin Coater

Laurell Spin Coater

FEI Helios NanoLab 460F1 DualBeam Focused Ion Beam (FIB)

TESCAN MIRA3 E-beam Writer

Characterization

Woollam Alpha-SE Spectroscopic Ellipsometer

Bruker DektakPRO Profiler

Bruker Dimension Icon AFM

Evident LEXT Scanning Microscope​

Bruker FilmTek 2000

Semiprobe Probe Station & Keithley Paramter Analyzer

4 Dimensions 4 Point Probe

Caltex 3D Microscope

Nikon Eclipse LV150N Optical Microscope

Bonding/Dicing

MPP Wire Bonder

Disco Hi-Tec Dicing Saw

EVG 501 Wafer Bonder

Wet Processing

G&P POLI-400L Chemical Mechanical Polisher

G&N RC Plus Backside Grinder

Shellback Spin Rinse Dryer 820

Deposition/Diffusion

Cressington Gold Sputter Coater

Technic Semcon 1000 Cu Electroplater

Technic Semcon 1000 Ni Electroplater

CN1 Atomic Premium PEALD

CN1 Atomic Premium Thermal ALD

MTI RTP Anneal Furnace

Allwin21 AccuThermo AW610M RTP

Tystar LPCVD

Lesker PVD 75 E-Beam Evaporator 1

Lesker PVD 75 E-Beam Evaporator 2

Oxford Plasmalab 80 PECVD

Lesker PVD 200 DC Sputter

Lesker PVD 200 RF + DC Sputter

Minibrutes Oxidation/Anneal Furnace

PDS 2010 Labcoter2 Parylene Deposition System

Evatec CLN200E ScAlN Sputtering System 

Plasma Etching

Nordson March CS 1701 RIE tool

Plasma-Therm Corial F-Based ICP RIE

Oxford Estrelas DRIE

Samco UV-1 UV-Ozone Cleaner

Diener Plasma Cleaner

SPTS Xactix e2 XeF2 Etching System

Rapid Prototyping

PLS6.120D Laser Engraver

Roland MDX-50 Benchtop CNC

EnvisionTech 3D Printers

Other Equipment

Fume Hoods

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AggieFab Nanofabrication Facility (AggieFab)

Frederick E. Giesecke Engineering Research Building
1617 Research Parkway
College Station, TX 77843

Texas A&M Engineering Experiment Station
Texas A&M University Department of Electrical and Computer Engineering
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